IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
SIP1X16-041BLF

SIP1X16-041BLF

CONN SOCKET SIP 16POS GOLD

Amphenol ICC (FCI)
3,937 -

RFQ

SIP1X16-041BLF

データシート

Bulk SIP1x Obsolete SIP 16 (1 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
DPF316-998Z

DPF316-998Z

CONN IC DIP SOCKET 16POS TINLEAD

Amphenol ICC (FCI)
2,766 -

RFQ

DPF316-998Z

データシート

Bag DPF3 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DPF314-998Z

DPF314-998Z

CONN IC DIP SOCKET 14POS TINLEAD

Amphenol ICC (FCI)
2,020 -

RFQ

DPF314-998Z

データシート

Bag DPF3 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DPF308-998Z

DPF308-998Z

CONN IC DIP SOCKET 8POS TIN-LEAD

Amphenol ICC (FCI)
3,799 -

RFQ

DPF308-998Z

データシート

Bag DPF3 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP1X02-041BLF

SIP1X02-041BLF

CONN SOCKET SIP 2POS GOLD

Amphenol ICC (FCI)
2,938 -

RFQ

SIP1X02-041BLF

データシート

Bulk SIP1x Obsolete SIP 2 (1 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
1-1747890-1

1-1747890-1

CONN SOCKET LGA 771POS GOLD

TE Connectivity AMP Connectors
3,291 -

RFQ

1-1747890-1

データシート

Tray - Obsolete LGA 771 (33 x 33) 0.043 (1.09mm) Gold - Copper Alloy Surface Mount Open Frame Solder 0.043 (1.09mm) - - - Thermoplastic
1735315-4

1735315-4

CONN SOCKET PGA ZIF 939POS GOLD

TE Connectivity AMP Connectors
3,642 -

RFQ

1735315-4

データシート

Tray - Obsolete PGA, ZIF (ZIP) 939 (31 x 31) 0.050 (1.27mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic
1871554-1

1871554-1

CONN SKT 1207-F RIGHT LEVER SMD

TE Connectivity AMP Connectors
2,621 -

RFQ

1871554-1

データシート

Bulk - Obsolete LGA 1207 (33 x 34) 0.043 (1.09mm) Gold - Copper Alloy Surface Mount Closed Frame Solder 0.043 (1.09mm) Gold - Copper Alloy Thermoplastic
1761503-1

1761503-1

CONN SOCKET PGA 940POS GOLD

TE Connectivity AMP Connectors
2,337 -

RFQ

1761503-1

データシート

Tray - Active PGA 940 (30 x 30) 0.050 (1.27mm) Gold 30.0µin (0.76µm) - Surface Mount Closed Frame - - - - - -
1-1903401-4

1-1903401-4

CONN SOCKET PGA 638POS GOLD

TE Connectivity AMP Connectors
2,759 -

RFQ

1-1903401-4

データシート

Tape & Reel (TR),Cut Tape (CT) - Obsolete PGA 638 (26 x 26) 0.050 (1.27mm) Gold Flash Copper Alloy Surface Mount Open Frame Solder 0.050 (1.27mm) Gold - Copper Alloy Thermoplastic
1674770-6

1674770-6

CONN SOCKET PGA ZIF 479POS GOLD

TE Connectivity AMP Connectors
2,783 -

RFQ

1674770-6

データシート

Tape & Reel (TR),Cut Tape (CT) - Obsolete PGA, ZIF (ZIP) 479 (26 x 26) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.050 (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic
8180-E1

8180-E1

CONN TRANSIST TO-3 4POS TIN

Aavid, Thermal Division of Boyd Corporation
3,640 -

RFQ

8180-E1

データシート

Bulk 8180 Active Transistor, TO-3 4 (Oval) - Tin - Steel Through Hole Closed Frame Solder - Tin - Steel Polyamide (PA), Nylon, Glass Filled
A28-LC-7-TT-R

A28-LC-7-TT-R

CONN IC DIP SOCKET 28POS TIN

Assmann WSW Components
3,849 -

RFQ

A28-LC-7-TT-R

データシート

Box - Obsolete DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT)
MHAS-181-ZMGG-15

MHAS-181-ZMGG-15

CONN SOCKET BGA 181POS GOLD

Samtec Inc.
2,327 -

RFQ

MHAS-181-ZMGG-15

データシート

Bulk MHA Obsolete BGA 181 (15 x 15) 0.100 (2.54mm) Gold - - Through Hole Open Frame Solder 0.100 (2.54mm) Gold - - -
100-006-050

100-006-050

CONN IC DIP SOCKET 6POS GOLD

3M
2,086 -

RFQ

100-006-050

データシート

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-008-050

100-008-050

CONN IC DIP SOCKET 8POS GOLD

3M
3,451 -

RFQ

100-008-050

データシート

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-008-051

100-008-051

CONN IC DIP SOCKET 8POS GOLD

3M
2,994 -

RFQ

100-008-051

データシート

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-010-050

100-010-050

CONN IC DIP SOCKET 10POS GOLD

3M
2,619 -

RFQ

100-010-050

データシート

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-014-050

100-014-050

CONN IC DIP SOCKET 14POS GOLD

3M
2,112 -

RFQ

100-014-050

データシート

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-014-051

100-014-051

CONN IC DIP SOCKET 14POS GOLD

3M
2,703 -

RFQ

100-014-051

データシート

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
Total 21991 Record«Prev1... 773774775776777778779780...1100Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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