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IC、トランジスタ用ソケット
| 写真: | メーカー部品番号 | 在庫状況 | 価格 | 数量 | データシート | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SIP1X16-041BLFCONN SOCKET SIP 16POS GOLD Amphenol ICC (FCI) |
3,937 | - |
RFQ |
データシート |
Bulk | SIP1x | Obsolete | SIP | 16 (1 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
DPF316-998ZCONN IC DIP SOCKET 16POS TINLEAD Amphenol ICC (FCI) |
2,766 | - |
RFQ |
データシート |
Bag | DPF3 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
DPF314-998ZCONN IC DIP SOCKET 14POS TINLEAD Amphenol ICC (FCI) |
2,020 | - |
RFQ |
データシート |
Bag | DPF3 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
DPF308-998ZCONN IC DIP SOCKET 8POS TIN-LEAD Amphenol ICC (FCI) |
3,799 | - |
RFQ |
データシート |
Bag | DPF3 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SIP1X02-041BLFCONN SOCKET SIP 2POS GOLD Amphenol ICC (FCI) |
2,938 | - |
RFQ |
データシート |
Bulk | SIP1x | Obsolete | SIP | 2 (1 x 2) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
1-1747890-1CONN SOCKET LGA 771POS GOLD TE Connectivity AMP Connectors |
3,291 | - |
RFQ |
データシート |
Tray | - | Obsolete | LGA | 771 (33 x 33) | 0.043 (1.09mm) | Gold | - | Copper Alloy | Surface Mount | Open Frame | Solder | 0.043 (1.09mm) | - | - | - | Thermoplastic |
|
1735315-4CONN SOCKET PGA ZIF 939POS GOLD TE Connectivity AMP Connectors |
3,642 | - |
RFQ |
データシート |
Tray | - | Obsolete | PGA, ZIF (ZIP) | 939 (31 x 31) | 0.050 (1.27mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
1871554-1CONN SKT 1207-F RIGHT LEVER SMD TE Connectivity AMP Connectors |
2,621 | - |
RFQ |
データシート |
Bulk | - | Obsolete | LGA | 1207 (33 x 34) | 0.043 (1.09mm) | Gold | - | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.043 (1.09mm) | Gold | - | Copper Alloy | Thermoplastic |
|
1761503-1CONN SOCKET PGA 940POS GOLD TE Connectivity AMP Connectors |
2,337 | - |
RFQ |
データシート |
Tray | - | Active | PGA | 940 (30 x 30) | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | - | Surface Mount | Closed Frame | - | - | - | - | - | - |
|
|
1-1903401-4CONN SOCKET PGA 638POS GOLD TE Connectivity AMP Connectors |
2,759 | - |
RFQ |
データシート |
Tape & Reel (TR),Cut Tape (CT) | - | Obsolete | PGA | 638 (26 x 26) | 0.050 (1.27mm) | Gold | Flash | Copper Alloy | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | - | Copper Alloy | Thermoplastic |
|
1674770-6CONN SOCKET PGA ZIF 479POS GOLD TE Connectivity AMP Connectors |
2,783 | - |
RFQ |
データシート |
Tape & Reel (TR),Cut Tape (CT) | - | Obsolete | PGA, ZIF (ZIP) | 479 (26 x 26) | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
|
8180-E1CONN TRANSIST TO-3 4POS TIN Aavid, Thermal Division of Boyd Corporation |
3,640 | - |
RFQ |
データシート |
Bulk | 8180 | Active | Transistor, TO-3 | 4 (Oval) | - | Tin | - | Steel | Through Hole | Closed Frame | Solder | - | Tin | - | Steel | Polyamide (PA), Nylon, Glass Filled |
|
A28-LC-7-TT-RCONN IC DIP SOCKET 28POS TIN Assmann WSW Components |
3,849 | - |
RFQ |
データシート |
Box | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
|
MHAS-181-ZMGG-15CONN SOCKET BGA 181POS GOLD Samtec Inc. |
2,327 | - |
RFQ |
データシート |
Bulk | MHA | Obsolete | BGA | 181 (15 x 15) | 0.100 (2.54mm) | Gold | - | - | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | - | - | - |
|
|
100-006-050CONN IC DIP SOCKET 6POS GOLD 3M |
2,086 | - |
RFQ |
データシート |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-008-050CONN IC DIP SOCKET 8POS GOLD 3M |
3,451 | - |
RFQ |
データシート |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-008-051CONN IC DIP SOCKET 8POS GOLD 3M |
2,994 | - |
RFQ |
データシート |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-010-050CONN IC DIP SOCKET 10POS GOLD 3M |
2,619 | - |
RFQ |
データシート |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-014-050CONN IC DIP SOCKET 14POS GOLD 3M |
2,112 | - |
RFQ |
データシート |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-014-051CONN IC DIP SOCKET 14POS GOLD 3M |
2,703 | - |
RFQ |
データシート |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
- 1500+ 日平均RFQ
- 20,000.000 標準製品ユニット
- 1800+ 世界中のメーカー
- 15,000+ 在庫倉庫
