IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
XR2A-2815

XR2A-2815

CONN IC DIP SOCKET 28POS GOLD

Omron Electronics Inc-EMC Div
2,233 -

RFQ

XR2A-2815

データシート

Bulk XR2 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2C-1511-N

XR2C-1511-N

CONN SOCKET SIP 15POS GOLD

Omron Electronics Inc-EMC Div
2,389 -

RFQ

XR2C-1511-N

データシート

Bulk XR2 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2E-3204

XR2E-3204

CONN SOCKET SIP 32POS GOLD

Omron Electronics Inc-EMC Div
3,248 -

RFQ

XR2E-3204

データシート

Bulk XR2 Obsolete SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2H-1611-N

XR2H-1611-N

CONN ZIG-ZAG 16POS GOLD

Omron Electronics Inc-EMC Div
3,072 -

RFQ

XR2H-1611-N

データシート

Bulk XR2 Active Zig-Zag 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
1-345442-3

1-345442-3

CONN SOCKET PGA 68POS GOLD

TE Connectivity AMP Connectors
3,617 -

RFQ

1-345442-3

データシート

Bulk - Obsolete PGA 68 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Thermoplastic, Polyester, Glass Filled
1814640-2

1814640-2

CONN IC DIP SOCKET 4POS GOLD

TE Connectivity AMP Connectors
2,867 -

RFQ

1814640-2

データシート

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 5.00µin (0.127µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Gold 5.00µin (0.127µm) Brass Thermoplastic, Polyester
1814640-6

1814640-6

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors
3,485 -

RFQ

1814640-6

データシート

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Thermoplastic, Polyester
1814640-7

1814640-7

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors
2,823 -

RFQ

1814640-7

データシート

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic, Polyester
1814640-8

1814640-8

CONN IC DIP SOCKET 8POS TIN

TE Connectivity AMP Connectors
3,660 -

RFQ

1814640-8

データシート

Bulk,Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester
1814640-9

1814640-9

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors
3,830 -

RFQ

1814640-9

データシート

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Thermoplastic, Polyester
1-1814640-1

1-1814640-1

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors
2,170 -

RFQ

1-1814640-1

データシート

Tape & Reel (TR) - Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 5.00µin (0.127µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Gold 5.00µin (0.127µm) Brass Thermoplastic, Polyester
1-1814640-7

1-1814640-7

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors
3,363 -

RFQ

1-1814640-7

データシート

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 5.00µin (0.127µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Gold 5.00µin (0.127µm) Brass Thermoplastic, Polyester
2-1814640-5

2-1814640-5

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors
2,303 -

RFQ

2-1814640-5

データシート

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic, Polyester
2-1814640-6

2-1814640-6

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors
3,424 -

RFQ

2-1814640-6

データシート

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester
1814642-1

1814642-1

CONN IC DIP SOCKET 4POS GOLD

TE Connectivity AMP Connectors
2,214 -

RFQ

1814642-1

データシート

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic, Polyester
2-1814642-6

2-1814642-6

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors
2,795 -

RFQ

2-1814642-6

データシート

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester
2-1814642-7

2-1814642-7

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors
3,334 -

RFQ

2-1814642-7

データシート

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Thermoplastic, Polyester
1814643-3

1814643-3

CONN IC DIP SOCKET 4POS GOLD

TE Connectivity AMP Connectors
2,286 -

RFQ

1814643-3

データシート

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Thermoplastic, Polyester
1814643-8

1814643-8

CONN IC DIP SOCKET 10POS GOLD

TE Connectivity AMP Connectors
3,429 -

RFQ

1814643-8

データシート

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Thermoplastic, Polyester
2-1814643-1

2-1814643-1

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
2,286 -

RFQ

2-1814643-1

データシート

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Thermoplastic, Polyester
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1500+ 日平均RFQ
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20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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