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IC、トランジスタ用ソケット

メーカー部品番号	在庫状況	価格	数量	データシート	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
8058-24G1 CONN TRANSIST TO-5 10POS GOLD TE Connectivity AMP Connectors	2,727	-	RFQ		Bulk	8058	Obsolete	Transistor, TO-5	10 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Brass	Polytetrafluoroethylene (PTFE)
9-1437508-4 CONN TRANSIST TO-5 4POS GOLD TE Connectivity AMP Connectors	2,315	-	RFQ		Bulk	8058	Obsolete	Transistor, TO-5	4 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Brass	Polytetrafluoroethylene (PTFE)
6-6437504-2 CONN TRANSIST TO-3 3POS SILVER TE Connectivity AMP Connectors	3,396	-	RFQ	データシート	Bulk,Bulk	8080	Obsolete	Transistor, TO-3	3 (Oval)	-	Silver	-	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Silver	-	Beryllium Copper	Diallyl Phthalate (DAP)
1-1747890-2 CONN SOCKET LGA 771POS GOLD TE Connectivity AMP Connectors	2,034	-	RFQ	データシート	Tray	-	Obsolete	LGA	771 (33 x 33)	0.043 (1.09mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.043 (1.09mm)	-	-	-	Thermoplastic
1-2013620-3 CONN SOCKET PGA ZIF 988POS GOLD TE Connectivity AMP Connectors	3,980	-	RFQ		Tape & Reel (TR)	-	Obsolete	PGA, ZIF (ZIP)	988 (35 x 36)	0.039 (1.00mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.039 (1.00mm)	-	-	Copper Alloy	Thermoplastic
2013620-3 CONN SOCKET PGA ZIF 989POS GOLD TE Connectivity AMP Connectors	3,801	-	RFQ		Tape & Reel (TR),Box	-	Active	PGA, ZIF (ZIP)	989 (35 x 36)	0.039 (1.00mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.039 (1.00mm)	-	-	Copper Alloy	Thermoplastic
2040540-2 CONN SOCKET LGA 1156POS GOLD TE Connectivity AMP Connectors	3,065	-	RFQ	データシート	Tray,Box	-	Active	LGA	1156 (34 x 34)	0.036 (0.91mm)	Gold	Flash	Copper Alloy	Surface Mount	Closed Frame	Solder	0.039 (1.00mm)	-	-	Copper Alloy	Thermoplastic
WMS-100Z CONN IC DIP SOCKET 10POS GOLD On Shore Technology Inc.	3,920	-	RFQ	データシート	Tube	WMS	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame, Wash Away	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	-
4842-6004-CP CONN IC DIP SOCKET 42POS TIN 3M	2,405	-	RFQ		Bulk	4800	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Tin	135.0µin (3.43µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	135.0µin (3.43µm)	Phosphor Bronze	Polyester, Glass Filled
516-AG11D-ES DIP SOCKET T/H 16POS TE Connectivity AMP Connectors	2,265	-	RFQ	データシート	Tube	500	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	-	Copper Alloy	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester
0473370001 CONN CAM SOCKET 24POS GOLD Molex	2,111	-	RFQ	データシート	Tape & Reel (TR),Cut Tape (CT)	47337	Obsolete	Camera Socket	24 (4 x 6)	0.035 (0.90mm)	Gold	12.0µin (0.30µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.035 (0.90mm)	Gold	Flash	Copper Alloy	Polyamide (PA), Nylon
WMS-420Z CONN IC DIP SOCKET 42POS GOLD On Shore Technology Inc.	3,759	-	RFQ	データシート	Tube	WMS	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame, Wash Away	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	-
WMS-480Z CONN IC DIP SOCKET 48POS GOLD On Shore Technology Inc.	2,462	-	RFQ	データシート	Tube	WMS	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame, Wash Away	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	-
XR2C-2000-HSG CONN IC SOCKET 20POS Omron Electronics Inc-EMC Div	3,035	-	RFQ	データシート	Bulk,Bulk	XR2	Obsolete	Housing	20 (1 x 20)	0.100 (2.54mm)	-	-	Beryllium Copper	-	Closed Frame	Solder	0.100 (2.54mm)	-	-	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled
XR2C-3200-HSG CONN IC SOCKET 32POS Omron Electronics Inc-EMC Div	3,790	-	RFQ	データシート	Bulk	XR2	Active	Housing	32 (1 x 32)	0.100 (2.54mm)	-	-	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	-	-	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled
XR2E-3205 CONN SOCKET SIP 32POS GOLD Omron Electronics Inc-EMC Div	3,841	-	RFQ	データシート	Bulk	XR2	Obsolete	SIP	32 (1 x 32)	0.100 (2.54mm)	Gold	-	Beryllium Copper	-	-	Solder	0.100 (2.54mm)	Gold	-	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled
XR2D-2401-N CONN IC DIP SOCKET 24POS GOLD Omron Electronics Inc-EMC Div	3,839	-	RFQ	データシート	Bulk	XR2	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier	Solder	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled
XR2D-4001-N CONN IC DIP SOCKET 40POS GOLD Omron Electronics Inc-EMC Div	3,670	-	RFQ	データシート	Bulk	XR2	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier	Solder	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled
XR2E-3201-N CONN SOCKET SIP 32POS GOLD Omron Electronics Inc-EMC Div	2,832	-	RFQ	データシート	Bulk	XR2	Obsolete	SIP	32 (1 x 32)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier	Solder	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled
0479890112 CONN SOCKET PGA 989POS GOLD Molex	3,150	-	RFQ	データシート	Tray	47989	Obsolete	PGA	989 (35 x 36)	0.039 (1.00mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.039 (1.00mm)	-	-	-	Liquid Crystal Polymer (LCP)