+86 075582561136
BOMをアップロード
IC、トランジスタ用ソケット
| 写真: | メーカー部品番号 | 在庫状況 | 価格 | 数量 | データシート | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
0475940002CONN SOCKET LGA 1366POS GOLD Molex |
2,660 | - |
RFQ |
データシート |
Tray | 47594 | Obsolete | LGA | 1366 (32 x 41) | 0.040 (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040 (1.01mm) | - | - | - | Liquid Crystal Polymer (LCP) |
|
0475943001CONN SOCKET LGA 1356POS GOLD Molex |
2,198 | - |
RFQ |
データシート |
Tray | 47594 | Obsolete | LGA | 1356 (32 x 41) | 0.040 (1.02mm) | Gold | 15.0µin (0.38µm) | - | Surface Mount | Open Frame | - | - | - | - | - | - |
|
0475960132CONN SOCKET LGA 1156POS GOLD Molex |
3,009 | - |
RFQ |
データシート |
Tray | 47596 | Obsolete | LGA | 1156 (40 x 40) | 0.036 (0.91mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.036 (0.91mm) | - | - | - | Thermoplastic |
|
|
0475960232CONN SOCKET LGA 1155POS GOLD Molex |
2,454 | - |
RFQ |
データシート |
Tray | 47596 | Obsolete | LGA | 1155 (40 x 40) | 0.036 (0.91mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.036 (0.91mm) | - | - | - | Thermoplastic |
|
|
0475960233CONN SOCKET LGA 1155POS GOLD Molex |
3,243 | - |
RFQ |
データシート |
Tray | 47596 | Obsolete | LGA | 1155 (40 x 40) | 0.036 (0.91mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.036 (0.91mm) | - | - | - | Thermoplastic |
|
SA649000CONN IC DIP SOCKET 64POS GOLD On Shore Technology Inc. |
2,853 | - |
RFQ |
データシート |
Tube | SA | Obsolete | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester, Glass Filled |
|
SA649040CONN IC DIP SOCKET 64POS GOLD On Shore Technology Inc. |
2,536 | - |
RFQ |
データシート |
Tube | SA | Obsolete | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 80.0µin (2.03µm) | Brass | Thermoplastic, Polyester, Glass Filled |
|
|
ICO-314-M-TTCONN IC DIP SOCKET 14POS TIN Samtec Inc. |
2,120 | - |
RFQ |
データシート |
Bulk | ICO | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
|
ICO-316-M-TTCONN IC DIP SOCKET 16POS TIN Samtec Inc. |
2,991 | - |
RFQ |
データシート |
Bulk | ICO | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
|
232-1270-51-0602STAGGERED ZIP STRIP POCKETS 32 C 3M |
2,597 | - |
RFQ |
- | Textool™ | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
232-1270-52-0602STAGGERED ZIP STRIP POCKETS 32 C 3M |
2,012 | - |
RFQ |
- | Textool™ | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
232-1271-00-1102JHOEM LCC SOCKETS 32 POS SOLID LID 3M |
2,267 | - |
RFQ |
データシート |
- | OEM | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
234-3034-51-0602CONN ZIG-ZAG ZIF 34POS GOLD 3M |
3,300 | - |
RFQ |
Bulk | Textool™ | Active | Zig-Zag, ZIF (ZIP) | 34 (2 x 17) | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | |
|
|
234-3034-52-0602CONN ZIG-ZAG ZIF 34POS GOLD 3M |
3,697 | - |
RFQ |
Bulk | Textool™ | Active | Zig-Zag, ZIF (ZIP) | 34 (2 x 17) | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | |
|
|
235-3019-51-0602CONN ZIG-ZAG ZIF 35POS GOLD 3M |
2,586 | - |
RFQ |
Bulk | Textool™ | Active | Zig-Zag, ZIF (ZIP) | 35 (1 x 17, 1 x 18) | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | |
|
|
235-3019-52-0602CONN ZIG-ZAG ZIF 35POS GOLD 3M |
3,841 | - |
RFQ |
Bulk | Textool™ | Active | Zig-Zag, ZIF (ZIP) | 35 (1 x 17, 1 x 18) | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | |
|
|
236-6225-50-0602SOCKET ZIP IN-LINE 36POS 3M |
3,445 | - |
RFQ |
Box | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
239-5605-51-0602CONN SOCKET 39POS ZIP STRIP 3M |
3,702 | - |
RFQ |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
239-5605-52-0602CONN SOCKET 39POS ZIP STRIP 3M |
2,175 | - |
RFQ |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
251-5949-51-0602CONN ZIG-ZAG ZIF 51POS GOLD 3M |
3,771 | - |
RFQ |
Bulk | Textool™ | Active | Zig-Zag, ZIF (ZIP) | 51 (1 x 25, 1 x 26) | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
- 1500+ 日平均RFQ
- 20,000.000 標準製品ユニット
- 1800+ 世界中のメーカー
- 15,000+ 在庫倉庫
