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| 写真: | メーカー部品番号 | 在庫状況 | 価格 | 数量 | データシート | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AR 32-HZL-TTCONN IC DIP SOCKET 32POS TIN Assmann WSW Components |
2,214 | - |
RFQ |
データシート |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
110-83-316-01-822101CONN IC DIP SOCKET 16POS GOLD Preci-Dip |
3,115 | - |
RFQ |
データシート |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8), 4 Loaded | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-306-41-008101CONN IC DIP SOCKET 6POS GOLD Preci-Dip |
2,935 | - |
RFQ |
データシート |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
612-87-312-41-001101CONN IC DIP SOCKET 12POS GOLD Preci-Dip |
3,331 | - |
RFQ |
データシート |
Bulk | 612 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-306-41-011101CONN IC DIP SOCKET 6POS GOLD Preci-Dip |
3,849 | - |
RFQ |
データシート |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-83-308-31-012101CONN IC DIP SOCKET 8POS GOLD Preci-Dip |
3,252 | - |
RFQ |
データシート |
Bulk | 614 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
AW 127-40/Z-TSOCKET 40 CONTACTS SINGLE ROW Assmann WSW Components |
2,712 | - |
RFQ |
データシート |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
116-87-308-41-002101CONN IC DIP SOCKET 8POS GOLD Preci-Dip |
3,803 | - |
RFQ |
データシート |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-308-41-018101CONN IC DIP SOCKET 8POS GOLD Preci-Dip |
2,882 | - |
RFQ |
データシート |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
04-0513-10TCONN SOCKET SIP 4POS GOLD Aries Electronics |
3,000 | - |
RFQ |
データシート |
Bulk | 0513 | Active | SIP | 4 (1 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
01-0503-20CONN SOCKET SIP 1POS GOLD Aries Electronics |
2,355 | - |
RFQ |
データシート |
Bulk | 0503 | Active | SIP | 1 (1 x 1) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
01-0503-30CONN SOCKET SIP 1POS GOLD Aries Electronics |
2,774 | - |
RFQ |
データシート |
Bulk | 0503 | Active | SIP | 1 (1 x 1) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 30.0µin (0.76µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
116-87-610-41-003101CONN IC DIP SOCKET 10POS GOLD Preci-Dip |
2,806 | - |
RFQ |
データシート |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
146-87-308-41-035101CONN IC DIP SOCKET 8POS GOLD Preci-Dip |
3,706 | - |
RFQ |
データシート |
Tube | 146 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
146-87-308-41-036101CONN IC DIP SOCKET 8POS GOLD Preci-Dip |
2,113 | - |
RFQ |
データシート |
Bulk | 146 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
410-87-216-10-001101CONN ZIG-ZAG 16POS GOLD Preci-Dip |
3,445 | - |
RFQ |
データシート |
Bulk | 410 | Active | Zig-Zag, Left Stackable | 16 (2 x 8) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
410-87-216-10-002101CONN ZIG-ZAG 16POS GOLD Preci-Dip |
2,887 | - |
RFQ |
データシート |
Bulk | 410 | Active | Zig-Zag, Right Stackable | 16 (2 x 8) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
917-83-104-41-005101CONN TRANSIST TO-5 4POS GOLD Preci-Dip |
2,102 | - |
RFQ |
データシート |
Bulk | 917 | Active | Transistor, TO-5 | 4 (Round) | - | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | - | Solder | - | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
917-83-104-41-053101CONN TRANSIST TO-5 4POS GOLD Preci-Dip |
3,849 | - |
RFQ |
データシート |
Bulk | 917 | Active | Transistor, TO-5 | 4 (Round) | - | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | - | Solder | - | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
02-0513-11HCONN SOCKET SIP 2POS GOLD Aries Electronics |
2,938 | - |
RFQ |
データシート |
Bulk | 0513 | Active | SIP | 2 (1 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
- 1500+ 日平均RFQ
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