IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
114-83-312-41-117101

114-83-312-41-117101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,472 -

RFQ

114-83-312-41-117101

データシート

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-312-41-134161

114-83-312-41-134161

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,426 -

RFQ

114-83-312-41-134161

データシート

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-306-41-001101

116-83-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,715 -

RFQ

116-83-306-41-001101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
714-43-102-31-018000

714-43-102-31-018000

CONN SOCKET SIP 2POS GOLD

Mill-Max Manufacturing Corp.
674 -

RFQ

714-43-102-31-018000

データシート

Bulk 714 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-87-304-41-013101

116-87-304-41-013101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,298 -

RFQ

116-87-304-41-013101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-610-41-001101

614-83-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,345 -

RFQ

614-83-610-41-001101

データシート

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-318-41-003101

115-87-318-41-003101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,832 -

RFQ

115-87-318-41-003101

データシート

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
05-0518-10H

05-0518-10H

CONN SOCKET SIP 5POS GOLD

Aries Electronics
2,123 -

RFQ

05-0518-10H

データシート

Bulk 518 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-1518-10

06-1518-10

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics
2,120 -

RFQ

06-1518-10

データシート

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-306-41-004101

116-87-306-41-004101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,230 -

RFQ

116-87-306-41-004101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-310-41-105101

110-83-310-41-105101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,789 -

RFQ

110-83-310-41-105101

データシート

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-312-31-012101

614-87-312-31-012101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,254 -

RFQ

614-87-312-31-012101

データシート

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-310-41-007101

116-87-310-41-007101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,905 -

RFQ

116-87-310-41-007101

データシート

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-310-41-105191

110-87-310-41-105191

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,762 -

RFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-314-41-134191

114-87-314-41-134191

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,094 -

RFQ

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-308-41-001101

116-87-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,187 -

RFQ

116-87-308-41-001101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-310-41-001101

612-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,650 -

RFQ

612-83-310-41-001101

データシート

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-610-41-001101

612-83-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,691 -

RFQ

612-83-610-41-001101

データシート

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-318-41-117101

114-87-318-41-117101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,505 -

RFQ

114-87-318-41-117101

データシート

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-88-032-17-400-TR

540-88-032-17-400-TR

CONN SOCKET PLCC 32POS TIN

Preci-Dip
2,453 -

RFQ

540-88-032-17-400-TR

データシート

Tape & Reel (TR) 540 Active PLCC 32 (4 x 8) 0.050 (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
Total 21991 Record«Prev1... 7475767778798081...1100Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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