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写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-87-324-41-001151

110-87-324-41-001151

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,337 -

RFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-424-41-001101

110-87-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,928 -

RFQ

110-87-424-41-001101

データシート

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-318-41-001101

115-87-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,631 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-210-01-839101

110-83-210-01-839101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,368 -

RFQ

110-83-210-01-839101

データシート

Bulk 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5), 8 Loaded 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-312-41-001101

115-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,949 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-308-41-009101

116-87-308-41-009101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,641 -

RFQ

116-87-308-41-009101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
04-0518-00

04-0518-00

CONN SOCKET SIP 4POS GOLD

Aries Electronics
3,359 -

RFQ

04-0518-00

データシート

Bulk 518 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0518-11

04-0518-11

CONN SOCKET SIP 4POS GOLD

Aries Electronics
2,872 -

RFQ

04-0518-11

データシート

Bulk 518 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-1518-11

04-1518-11

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics
2,282 -

RFQ

04-1518-11

データシート

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0518-10T

05-0518-10T

CONN SOCKET SIP 5POS GOLD

Aries Electronics
2,792 -

RFQ

05-0518-10T

データシート

Bulk 518 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-83-310-41-001101

614-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,117 -

RFQ

614-83-310-41-001101

データシート

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-210-41-006101

116-83-210-41-006101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,207 -

RFQ

116-83-210-41-006101

データシート

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-018101

116-87-312-41-018101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,683 -

RFQ

116-87-312-41-018101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-210-41-105101

110-83-210-41-105101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,793 -

RFQ

110-83-210-41-105101

データシート

Bulk 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-310-41-012101

116-87-310-41-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,919 -

RFQ

116-87-310-41-012101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-610-41-012101

116-87-610-41-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,217 -

RFQ

116-87-610-41-012101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SMPX-20LCC-N-TR

SMPX-20LCC-N-TR

SMT PLCC 20P NON POLARISED, T&R

Kycon, Inc.
3,326 -

RFQ

SMPX-20LCC-N-TR

データシート

Tape & Reel (TR) SMPX Active PLCC 20 (4 x 5) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
110-83-314-41-001101

110-83-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,979 -

RFQ

110-83-314-41-001101

データシート

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-314-41-105101

110-87-314-41-105101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,916 -

RFQ

110-87-314-41-105101

データシート

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-314-41-001101

614-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,644 -

RFQ

614-87-314-41-001101

データシート

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 21991 Record«Prev1... 7374757677787980...1100Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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