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写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
146-83-308-41-036101

146-83-308-41-036101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,524 -

RFQ

146-83-308-41-036101

データシート

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-314-41-001101

115-83-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,012 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-306-41-105191

110-87-306-41-105191

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,487 -

RFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-316-41-001101

110-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,400 -

RFQ

110-83-316-41-001101

データシート

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-324-41-605101

110-87-324-41-605101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,538 -

RFQ

110-87-324-41-605101

データシート

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-324-41-005101

110-87-324-41-005101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,488 -

RFQ

110-87-324-41-005101

データシート

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-424-41-005101

110-87-424-41-005101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,830 -

RFQ

110-87-424-41-005101

データシート

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-314-41-018101

116-87-314-41-018101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,684 -

RFQ

116-87-314-41-018101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-316-41-001101

614-87-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,930 -

RFQ

614-87-316-41-001101

データシート

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-308-41-002101

116-83-308-41-002101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,599 -

RFQ

116-83-308-41-002101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SMPX-28LCC-N-TR

SMPX-28LCC-N-TR

SMT PLCC 28P NON POLARISED, T&R

Kycon, Inc.
3,204 -

RFQ

SMPX-28LCC-N-TR

データシート

Tape & Reel (TR) SMPX Active PLCC 28 (4 x 7) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
SMPX-32LCC-N-TR

SMPX-32LCC-N-TR

SMT PLCC 32P NON POLARISED, T&R

Kycon, Inc.
3,225 -

RFQ

SMPX-32LCC-N-TR

データシート

Tape & Reel (TR) SMPX Active PLCC 32 (2 x 7, 2 x 9) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
614-83-610-31-012101

614-83-610-31-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,513 -

RFQ

614-83-610-31-012101

データシート

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-210-41-002101

116-87-210-41-002101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,890 -

RFQ

116-87-210-41-002101

データシート

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-310-41-002101

116-87-310-41-002101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,909 -

RFQ

116-87-310-41-002101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SMPX-44LCC-N-TR

SMPX-44LCC-N-TR

SMT PLCC 44P NON POLARISED, T&R

Kycon, Inc.
3,877 -

RFQ

SMPX-44LCC-N-TR

データシート

Tape & Reel (TR) SMPX Active PLCC 44 (4 x 11) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
110-83-308-41-105191

110-83-308-41-105191

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,657 -

RFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-310-31-012101

614-83-310-31-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,653 -

RFQ

614-83-310-31-012101

データシート

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-210-41-003101

116-87-210-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,295 -

RFQ

116-87-210-41-003101

データシート

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
06-3518-10T

06-3518-10T

SOCKET W/SOLDER TAIL PINS TIM

Aries Electronics
2,517 -

RFQ

- 518 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
Total 21991 Record«Prev1... 7778798081828384...1100Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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