IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
03-0513-11

03-0513-11

CONN SOCKET SIP 3POS GOLD

Aries Electronics
3,698 -

RFQ

03-0513-11

データシート

Bulk 0513 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0513-10

05-0513-10

CONN SOCKET SIP 5POS GOLD

Aries Electronics
2,941 -

RFQ

05-0513-10

データシート

Bulk 0513 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-0518-10T

06-0518-10T

CONN SOCKET SIP 6POS GOLD

Aries Electronics
3,609 -

RFQ

06-0518-10T

データシート

Bulk 518 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-1518-10T

06-1518-10T

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics
3,225 -

RFQ

06-1518-10T

データシート

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
07-0518-10

07-0518-10

CONN SOCKET SIP 7POS GOLD

Aries Electronics
3,294 -

RFQ

07-0518-10

データシート

Bulk 518 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-310-41-003101

116-83-310-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,799 -

RFQ

116-83-310-41-003101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-314-41-117101

114-83-314-41-117101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,110 -

RFQ

114-83-314-41-117101

データシート

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-314-41-134161

114-83-314-41-134161

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,155 -

RFQ

114-83-314-41-134161

データシート

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-624-41-005101

110-87-624-41-005101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,446 -

RFQ

110-87-624-41-005101

データシート

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-624-41-605101

110-87-624-41-605101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,763 -

RFQ

110-87-624-41-605101

データシート

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-308-41-008101

116-83-308-41-008101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,478 -

RFQ

116-83-308-41-008101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-012101

116-87-312-41-012101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,099 -

RFQ

116-87-312-41-012101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-316-41-105101

110-87-316-41-105101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,061 -

RFQ

110-87-316-41-105101

データシート

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-320-41-117101

114-87-320-41-117101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,007 -

RFQ

114-87-320-41-117101

データシート

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-320-41-134161

114-87-320-41-134161

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,853 -

RFQ

114-87-320-41-134161

データシート

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-420-41-117101

114-87-420-41-117101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,244 -

RFQ

114-87-420-41-117101

データシート

Bulk 114 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-304-41-013101

116-83-304-41-013101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
2,661 -

RFQ

116-83-304-41-013101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-210-41-008101

116-87-210-41-008101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,575 -

RFQ

116-87-210-41-008101

データシート

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-310-41-008101

116-87-310-41-008101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,890 -

RFQ

116-87-310-41-008101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-314-31-012101

614-87-314-31-012101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,724 -

RFQ

614-87-314-31-012101

データシート

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 21991 Record«Prev1... 7879808182838485...1100Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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